TECHNOLOGY CAPABILITIES
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Layer Count[MAX]:
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18 L
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Min. Line Width/Space:
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0.076/0.076mm
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Min.Drilled Hole Size-Mechanical:
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0.2mm
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Min.Drilled Hole Size-Laser:
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0.1mm
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Max. Copper Thickness:
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6 OZ
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Layer To Layer Registration Tolerance :
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±0.076mm
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Max.Finished Board Thickness :
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5.0mm
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Min.Finished Board Thickness :
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0.4mm
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Min.Core Dielectric Thickness :
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0.076mm
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Max. Drill Aspect Ratio :
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10:01
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Press Fit Hole Tolerance :
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±0.05mm
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Min.Impedance Tolerance :
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±10%
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HDI Stack Up :
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1+N+1
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Controlled Depth Drilling Tolerance :
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±0.15mm
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Max Production Panel Size :
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24.5"*32"
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Via In PAD :
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YES
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BGA Pitch(with trace) :
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0.5mm
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Soldermask Registration :
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±0.038mm
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Min.Solder Dam :
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0.064mm
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